Efficient Study of Substrate Integrated Waveguide Devices

IW circuits are considered quasi3D (2,5D) metal-dielectric circuits. They have a high level of integration circuits, the metal and dielectric losses moderated and the precision of manufacturing for microwave applications [1]-[3]. The architecture of these structures consists in adding to the planar circuits a network of metallic via-hole integrated in the dielectric layer. The via-holes replace electric side walls as in the case of classical waveguide. In this paper, we propose a rigorous method of SIW circuits, based on a new iterative process. The Principe of WCIP method is based on the recurrent relation of the transverse incident-reflected waves between the two domains [4]-[7]. Transmission and reflection coefficients are presented and compared with measurements and with HFSS software (FEM method); then we evaluate the performance of the new method by comparing with HFSS, concerning the error and the simulation time.